发明名称 Semiconductor device and method for producing the same
摘要 A semiconductor device includes a SiC substrate and an ohmic electrode, a semiconductor member including a SiC member and a SiGe member being formed between the SiC substrate and the ohmic electrode, wherein the semiconductor member is composed of a SiGe member formed on a SiC member, and the ohmic electrode is formed on the SiGe member, whereby the ohmic electrode with a low resistance can be formed on the SiC substrate without conducting a heat treatment at a high temperature.
申请公布号 US6770912(B2) 申请公布日期 2004.08.03
申请号 US20020079951 申请日期 2002.02.19
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 OTA YORITO
分类号 H01L29/78;H01L21/04;H01L21/338;H01L21/74;H01L29/24;H01L29/45;H01L29/812;(IPC1-7):H01L29/06;H01L29/04;H01L31/036 主分类号 H01L29/78
代理机构 代理人
主权项
地址
您可能感兴趣的专利