发明名称 |
Semiconductor device and method for producing the same |
摘要 |
A semiconductor device includes a SiC substrate and an ohmic electrode, a semiconductor member including a SiC member and a SiGe member being formed between the SiC substrate and the ohmic electrode, wherein the semiconductor member is composed of a SiGe member formed on a SiC member, and the ohmic electrode is formed on the SiGe member, whereby the ohmic electrode with a low resistance can be formed on the SiC substrate without conducting a heat treatment at a high temperature.
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申请公布号 |
US6770912(B2) |
申请公布日期 |
2004.08.03 |
申请号 |
US20020079951 |
申请日期 |
2002.02.19 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OTA YORITO |
分类号 |
H01L29/78;H01L21/04;H01L21/338;H01L21/74;H01L29/24;H01L29/45;H01L29/812;(IPC1-7):H01L29/06;H01L29/04;H01L31/036 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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