发明名称 CHIP TYPE SOLID ELECTROLYTIC CAPACITOR HAVING SMALL SIZE AND SIMPLE STRUCTURE AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A chip type solid electrolytic capacitor having small size and simple structure to enhance volume efficiency of capacitor element and manufacturing method thereof are provided to reduce the number of fabrication processes by removing a bending process for a lead or a lead frame. CONSTITUTION: A chip type solid electrolytic capacitor includes a capacitor element, a packaging resin, and a terminal. The packaging resin(13) is used for covering the capacitor element(11). The package resin has a mount surface and a lateral surface adjacent to the mount surface. The terminal(14,17) is electrically connected to the capacitor element and is coupled to the packaging resin. The terminal extends along the mount surface and the lateral surface to include an outer surface exposed from the packaging resin and an inner surface opposite to the outer surface. The inner surface has a stepwise shape formed by forging.
申请公布号 KR20040068471(A) 申请公布日期 2004.07.31
申请号 KR20040003916 申请日期 2004.01.19
申请人 NEC TOKIN CORPORATION;NEC TOKIN TOYAMA, LTD. 发明人 SANO MITSUNORI;KONO TAKASHI;TSUTSUI MAKOTO
分类号 H01G9/08;H01G9/00;H01G9/012;H01G9/042;H01G9/10;H01G9/15;H01L21/44;H01L23/28;(IPC1-7):H01G9/012 主分类号 H01G9/08
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