| 摘要 |
A CONDUCTING STRUCTURE INCLUDES A DIELECTRIC MATRIX (32,132) WITH A FIRST SURFACE (34,134) AND A SECOND SURFACE (36,136). AT LEAST ONE VIA EXTENDS FROM THE FIRST SURFACE OF THE MATRIX TO THE SECOND SURFACE OF THE MATRIX. IN THE AT LEAST ONE VIA CONDUCTIVE MEMBERS ARE FORMED WHICH INCLUDE CONDUCTIVE ELEMENTS (42,142) AND AN OPTIONAL BINDER. THE CONDUCTIVE ELEMENTS (42,142) HAVE A MAXIMUM DIMENSION OF:(I) AT LEAST ABOUT 5OF A LENGTH OF THE VIA, AND, (II) AT LEAST ABOUT 10OF THE WIDTH OF THE VIA. THE SIZE, SHAPE AND NUMBER OF CONDUCTIVE ELEMENTS IN EACH VIA, AS WELL AS THE COMPOSITION OF THE BINDER, MAY BE SELECTED TO PROVIDE A CONDUCTIVE ELEMENT WITH A CONTROLLED ELECTRICAL AND/OR THERMAL CONDUCTIVITY, AND A CONTROLLED MODULES, FOR A PARTICULAR APPLICATION.
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