MATERIAL SENSOR MODULE USING FILM BULK ACOUSTIC RESONATOR

摘要

PURPOSE: A material sensor module using a film bulk acoustic resonator is provided to enhance the sensibility of a sensor by arranging a plurality of film bulk acoustic resonators on a single chip. CONSTITUTION: A material sensor module using a film bulk acoustic resonator includes a material sensor chip, a sensor package, and a signal processing circuit. The material sensor chip includes a material sensor. The material sensor is formed with a measurement resonator having a sensing material reaction layer and a reference resonator without the sensing material reaction layer. A film bulk acoustic piezoelectric material is shared by the measurement resonator and the reference resonator. The sensor package includes a pad for connecting the material sensor chip to each electrode, plural external connection pins, and a supporter for protecting and supporting the material sensor chip. The signal processing circuit is connected to electrodes of each resonator.