SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD THEREOF, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, FOR PREVENTING ROUGHNESS OF POLISHING PAD DUE TO NOTCHES

摘要

PURPOSE: A semiconductor substrate, a manufacturing method thereof, and a method for manufacturing a semiconductor device are provided to prevent a roughness of a polishing pad due to notches by adjusting curvature of both shoulder portions to be uniform. CONSTITUTION: A semiconductor substrate(12A,12B) has a notch(13A,13B) in an edge portion thereof. The notch has two shoulder portions, each of which is configured as an arc. A difference in curvature between the two shoulder portions is not less than 0 mm and not more than 0.1 mm. Each of the two shoulder portions has a curvature not less than 0.3 mm. The notch has a bottom portion configured as an arc and the bottom portion has a curvature not less than 1 mm.