发明名称 |
STACKED CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME |
摘要 |
A multi-chip electronic package which utilizes an organic, laminate chip carrier and a pair of semiconductor chips positioned on an upper surface of the carrier in a stacked orientation. The organic, laminate chip carrier is comprised of a plurality of conductive planes and dielectric layers and couples one or both of the chips to underlying conductors on the bottom surface thereof. The carrier may include a high-speed portion to assure high-frequen cy connection between the semiconductor chips and may also include an internal capacitor and/or thermally conductive member for enhanced operational capabilities. The first chip, e.g ., an ASIC chip, is solder bonded to the carrier while the second chip, e.g., a memory chip, is secured to the first chip's upper surface and coupled to the carrier using a plurality of wirebon d connections. |
申请公布号 |
CA2455024(A1) |
申请公布日期 |
2004.07.30 |
申请号 |
CA20042455024 |
申请日期 |
2004.01.09 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
FRALEY, LAWRENCE R.;MARKOVICH, VOYA |
分类号 |
H01L23/14;H01L23/31;H01L23/498;H01L23/538;H01L25/04;H01L25/065;H01L25/07;H01L25/18;H05K1/02;H05K1/11;H05K3/46 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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