发明名称 HOT MELT CONDUCTOR PASTE COMPOSITION
摘要 <p>The present invention provides a hot melt conductor paste composition that includes conductive particles and glass particles dispersed in a thermoplastic polymer system. The hot melt conductor paste composition according to the invention is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C. to form a flowable liquid that can be applied to a silicon substrate by screen printing. The hot melt conductor paste composition is particularly suitable for use in the fabrication of photovoltaic cells.</p>
申请公布号 KR20040068159(A) 申请公布日期 2004.07.30
申请号 KR20047007943 申请日期 2002.11.01
申请人 发明人
分类号 B05D1/26;H01B1/22;B05D1/32;B05D3/02;B05D5/00;B05D5/12;C08J3/00;C08K3/08;C08K3/40;C08L1/00;H01B1/00;H01B1/02;H01B13/00;H01L23/532;H01L31/0224;H05K1/09 主分类号 B05D1/26
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