| 摘要 |
PURPOSE: A flow soldering system is provided to be capable of performing a high-quality flow soldering process using a smokeless solder. CONSTITUTION: A solder tank(11) melts and supplies a solder. A chip nozzle(16b) is installed in the solder tank, and is supplied with a molten solder to solder a chip device inserted in a substrate(18) in a flow soldering manner. A nozzle(16a) deflects a molten solder fractionation in one direction so as to be contact with a soldering position of a conventional device inserted in the substrate. The first fall guide(17a) is attached at one end of the nozzle and guides a molten solder after a soldering process. A fractionation guide(17d) is attached at the other end of the nozzle and adjusts fractionation shape and height of the molten solder. The second fall guide(17e) is connected to one end of the fractionation guide and guides a fall of the molten solder.
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