发明名称 SUBSTRATE CLEANING DEVICE AND SUBSTRATE TREATING FACILITY, ESPECIALLY CONCERNED WITH REDUCING OCCUPANCY SPACE OF THE CLEANING DEVICE
摘要 <p>PURPOSE: A substrate cleaning device and a substrate treating facility are provided to supply at least two cleaning chambers including cleaning portions for cleaning the surface of a substrate, while the cleaning chambers are vertically laminated while being partially overlapped with each other, thereby reducing an occupancy size of the cleaning device. CONSTITUTION: An upper side of a base(11) is in horizontal oblong shape. A top space of the base(11), which is surrounded by a sidewall, is in hollow oblong prism shape. The oblong prism part is divided into an upper cleaning chamber(13) and a lower cleaning chamber(14). The upper cleaning chamber(13) and the lower cleaning chamber(14) are vertically laminated without being crossed in horizontal direction. The vertically laminated upper cleaning chamber(13) and the lower cleaning chamber(14) are controlled to form an area where images of the chambers are overlapped on a plane thereof to the maximum.</p>
申请公布号 KR20040067974(A) 申请公布日期 2004.07.30
申请号 KR20040003970 申请日期 2004.01.19
申请人 SHARP CORPORATION 发明人 YOSHIZAWA TAKENORI
分类号 G02F1/13;B08B5/00;B08B5/02;G02F1/1333;H01L21/00;H01L21/677;(IPC1-7):G02F1/13 主分类号 G02F1/13
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