METHOD FOR FABRICATING PCB

摘要

PURPOSE: A method for fabricating a PCB is provided to maximize the performance of the PCB by improving a flatness of a surface of the PCB. CONSTITUTION: A circuit pattern is formed on an insulating material layer of a PCB(Printed Circuit Board)(30). A first protection layer(39) is formed thereon to cover the circuit pattern, which is formed on a surface of the PCB. The first protection layer is selectively removed by an exposure process and a development process. A predetermined part for forming a pad part(43) is exposed on the circuit pattern of the PCB by the exposure process and the development process. The surface of the first protection layer is polished. A second protection layer(41) is formed on the first protection layer to expose the circuit pattern.