| 发明名称 |
THICK FILM CONDUCTOR COMPOSITIONS FOR USE ON ALUMINUM NITRIDE SUBSTRATES |
| 摘要 |
The invention is directed to a conductive thick film composition for use on an aluminum nitride substrate that utilizes a boron containing reactant and a metal oxide to promote adhesion. |
| 申请公布号 |
KR20040068118(A) |
申请公布日期 |
2004.07.30 |
| 申请号 |
KR20047005129 |
申请日期 |
2002.10.08 |
| 申请人 |
|
发明人 |
|
| 分类号 |
H01B1/22;C04B41/51;C04B41/88;H01L23/15;H01L23/498;H05K1/09 |
主分类号 |
H01B1/22 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
