| 摘要 |
PROBLEM TO BE SOLVED: To provide a base substrate of a semiconductor device wherein an external appearance of a solder can be easily checked, and there is no bad plating. SOLUTION: The base substrate of the semiconductor device is adapted such that a semiconductor 24 is packaged on the surface thereof, and electrical conduction between the semiconductor 24 and an external apparatus is achieved by an electrode 28 provided on the side thereof. In the base substrate, the electrodes 28 are provided on protruded parts 22d formed among a plurality of recessed parts provided in the side thereof. Consequently, the formation of a solder fillet can be easily checked from its external appearance upon packaging the semiconductor device on a mother board, etc. COPYRIGHT: (C)2004,JPO&NCIPI
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