发明名称 ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To make fixing of a conductive cover to an insulating sheet easy, and to insulate a mounting board on which an electronic component is mounted from the conductive cover. SOLUTION: A cover back surface 94 and a cover front surface 96 comprise a first alignment which allows the surface facing the mounting substrate of a second cover body 88, and a second insulating sheet to regulate the relative position in the direction parallel to their lamination direction. The first alignment comprises a plurality of first bending parts 112 of a plurality of second bending parts 114. A cover lower surface 90 and a cover upper surface 92 comprise a second alignment which allows the surface facing the mounting substrate of the second cover body 88 and the second insulating sheet to regulate the relative position in a direction perpendicular to their lamination directions. The second alignment parts comprise a plurality of tabs 104, respectively. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004214303(A) 申请公布日期 2004.07.29
申请号 JP20020380048 申请日期 2002.12.27
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TAKAGI TOSHIO;SATO SAKAE
分类号 H05K5/00;H05K5/03;(IPC1-7):H05K5/00 主分类号 H05K5/00
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