发明名称 |
INTEGRATED OPTICAL DETECTOR DIRECTLY ATTACHED TO READOUT INTEGRATED CIRCUIT |
摘要 |
Optical receiver modules are used for receiving high-speed optical data signals. Unfortunately, these optical receiver modules are often tested for the first time after they are packaged in a housing. Thus significant costs are associated with those packaged devices that fail to meet predetermined criteria. An integrated optical receiver module is proposed that has an optical detector direct attached, or flip-chipped or bumped, onto an integrated circuit having an amplifier circuit. The direct attach process is performed when the integrated circuits still reside on a semiconductor wafer prior to dicing thereof. Thus, high speed optical testing of the optical receiver module is possible on a wafer level to determine actual performance characteristics thereof prior to dicing. |
申请公布号 |
WO2004038964(A3) |
申请公布日期 |
2004.07.29 |
申请号 |
WO2003CA01614 |
申请日期 |
2003.10.24 |
申请人 |
SIGE SEMICONDUCTOR INC.;SHERAZI, IMRAN;KOVACIC, STEPHEN, J. |
发明人 |
SHERAZI, IMRAN;KOVACIC, STEPHEN, J. |
分类号 |
H04B10/158 |
主分类号 |
H04B10/158 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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