| 发明名称 |
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same |
| 摘要 |
|
| 申请公布号 |
US2004147089(A1) |
申请公布日期 |
2004.07.29 |
| 申请号 |
US20040757214 |
申请日期 |
2004.01.14 |
| 申请人 |
PETRARCA KEVIN S;CANAPERI DONALD;KRISHNAN MAHADEVAIYER;STEIN KENNETH JAY;VOLANT RICHARD P |
发明人 |
PETRARCA KEVIN S;CANAPERI DONALD;KRISHNAN MAHADEVAIYER;STEIN KENNETH JAY;VOLANT RICHARD P |
| 分类号 |
H01L21/288;H01L21/02;H01L21/3205;H01L21/768;H01L21/822;H01L23/52;H01L27/04;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/288 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
