发明名称 MANUFACTURING SYSTEM, AND OPERATING METHOD FOR PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To enable a substrate to be directly set in a processing device without transferring the substrate (especially, a TFT substrate) by using a carrying container, and to allow one container to carry substrates of different sizes by efficiently using the container. SOLUTION: In the manufacturing system, a substrate supplier 18 directly stores the substrate 11 in a carrying container 12 subjected to electrostatic countermeasure, and a substrate customer 19 directly sets the container 12 in the processing device after carrying. Therefore, the substrate 11 including the TFT substrate 11 can be carried, and transferring work can be eliminated, so that particle pollution to the substrate 11 or electrostatic discharge damage of the TFT substrate 11 can be prevented, A substrate holding portion of the container 12 is changed according to the size of the substrate 11 to be carried, and the substrates 11 having different size can be carried by one container 12. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004210421(A) 申请公布日期 2004.07.29
申请号 JP20020378734 申请日期 2002.12.26
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;MATSUDA NORIYUKI
分类号 B65D85/86;B65G49/06;H01L21/00;H01L21/673;H01L21/677;H01L21/68;H05H1/26;(IPC1-7):B65G49/06 主分类号 B65D85/86
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