| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging device which does not cost much, or has no restrictions on the design, or produces no void in resin, and which has a sensor section of a solid-state imaging chip not covered by sealing resin. SOLUTION: In the solid-state imaging device, the solid-state chip has the sensor formed at the center of a principal plane, and salient electrodes formed in the periphery. A wiring board is formed with a rectangular through hole and with an interconnection in the periphery of the through hole, and are placed opposite to the chip. The salient electrodes and the interconnection are electrically connected, and the solid-state chip and the wiring board are bonded to each other in the periphery of the through hole. Resin gathering spots which communicate with the through hole of the wiring board are formed at the four corners of the through hole. COPYRIGHT: (C)2004,JPO&NCIPI |
