APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method for processing a substrate which can wash well the periphery of the substrate. SOLUTION: The wafer holding device 6 includes six holding rollers 13 and 33. The holding rollers 13 and 33 are arranged on the circumference corresponding to the shape of the end face of a wafer W, which is held with its end face being abutting to the side surfaces of the holding rollers 13 and 33. The holding rollers 13 and 33 are pivotally provided to base parts 12 and 32 in order to rotate the wafer W with the wafer W being hold. Second feeding nozzles of washing solution for feeding a solution to remove slurry from the peripheries of the upper and lower surfaces of the wafer W and to etch an unnecessary thin film of the peripheries are provided to the peripheries. COPYRIGHT: (C)2004,JPO&NCIPI