发明名称 |
GLASS FRIT BOND AND PROCESS THEREFOR |
摘要 |
A lead-containing glass material of the type suitable for use in a wafer bonding process, wherein the moisture resistance of the glass material is increased by the presence of a lead phosphate coating on an outer exposed surface of the material, thereby acting as a barrier to reaction of moisture with the lead of the glass material. A source of reactive phosphate ions is applied to the glass material so as to spontaneously form the desired lead phosphate coating.
|
申请公布号 |
US2004146719(A1) |
申请公布日期 |
2004.07.29 |
申请号 |
US20030248503 |
申请日期 |
2003.01.24 |
申请人 |
DELPHI TECHNOLOGIES, INC |
发明人 |
BANEY WILLIAM J.;BANEY BRENDA BISER;HUDE HEATHER |
分类号 |
C03C8/08;C03C8/10;C03C17/02;C03C17/04;C04B37/02;(IPC1-7):B32B9/00 |
主分类号 |
C03C8/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|