| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate which has proper mass-productivity and reliability, improves the high-frequency characteristics and includes a fine conductor pattern. <P>SOLUTION: On a stainless plate 1 as a transfer substrate having electrical conductivity, a conductor layer 3 of a predetermined pattern is formed by pattern plating, by using a prepreg 4 as an adhesive sheet of proper peelability from the stainless plate 1; the stainless plate 1 and the prepreg 4 are overlapped and pressed, while being made to face the conductor layer 3 to the prepreg 4 for producing an insulating plate, where the conductor layer 3 is imbedded to substantially smooth its front surface on at least one side, and the insulating plates are laminated and integrated as the substrate with the other prepreg in between. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
