| 摘要 |
PROBLEM TO BE SOLVED: To raise the recognition rate in wafer recognition and to have as few dies left over as possible. SOLUTION: When a teaching key is pressed after replacement of a wafer, a CPU controls a Y-axis driving motor and an X-axis driving motor to move a Y table 24 and an X table 25 at the center of a wafer of a die feeder table 27 below a recognition camera 17, and then fetches an image imaged by the recognition camera 17 and then recognized by a recognition processing device. Then, the CPU finds the centers of dies at the far left and at the far right which are projected in field of view of the recognition camera 17, and calculates a tilt of a lateral row of the wafers from the centers and stores it in a RAM. In order for a die D that should be picked up from on the die feeder table 27 to be imaged by the recognition camera 17 and recognized by the recognition processing apparatus before it is picked up, the CPU controls the Y-axis driving motor and the X-axis driving motor so that they may be translocated correctly in consideration of the tilt or the like. COPYRIGHT: (C)2004,JPO&NCIPI |
