| 摘要 |
PROBLEM TO BE SOLVED: To provide a module that incorporates components in which mounting density can be enhanced through a simple arrangement regardless of the respective shapes of a plurality of components or the forming positions of wire connecting pads. SOLUTION: The module that incorporates components comprises a printed wiring board 11 having a plurality of wire connecting pads 22 formed in a region on the outside of a component mounting region on one surface, a plurality of submodules 12<SB>1</SB>-12<SB>4</SB>formed sequentially on one side of the component mounting region while having an interposer substrate 31<SB>j</SB>provided with at least one wire connecting pad 23 formed in the vicinity of the outer edge part and conductor passages 33 for electrically connecting the I/O terminals of mounted components 32<SB>j</SB>(j=1-4) with the wire connecting pads 23, and a plurality of wiring wires 21 for electrically connecting the wire connecting pads 23 of the plurality of submodules 12<SB>1</SB>-12<SB>4</SB>with the wire connecting pads 22 of the printed wiring board 11. COPYRIGHT: (C)2004,JPO&NCIPI
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