| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-sided printed circuit board requiring no via hole by forming a circuit pattern on only one side of a flexible substrate and folding it, and to provide a method for manufacturing it. SOLUTION: The double-sided printed circuit board includes a double insulating layers formed by folding one flexible insulative substrate, a circuit pattern formed over the folded side of the insulating layer and formed on the upper and lower sides of the insulating layer, a solder resist layer for protecting the circuit pattern, and a plurality of connection parts electrically connected by the circuit pattern and connected to the other substrate, chip or the like. COPYRIGHT: (C)2004,JPO&NCIPI
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