Method for producing a semiconductor component and a semiconductor component produced according to this method

摘要

A method for manufacturing a semiconductor component (100; . . . ; 700), a multilayer semiconductor component in particular, preferably a micromechanical component, such as a heat transfer sensor in particular having a semiconductor substrate (101), in particular made of silicon, and a sensor region (404). For inexpensive manufacture of a thermal insulation between the semiconductor substrate (101) and the sensor region (404) a porous layer (104; 501) is provided in the semiconductor component (100; . . . ; 700).