SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SAME

摘要

When a semiconductor chip is mounted on a mounting board by bonding bumps to each other, failure of bonding occurs due to mutual positional shift of the bumps. Before a semiconductor chip having a plurality of bumps formed thereon is mounted on a mounting board (3) having a plurality of bumps (4) formed thereon by flip-chip system, a resist layer (5) is formed thicker than the bump (4) on the mounting board (3) on which bumps are formed and then patterned to form a protrusion guide (5A) of semicircular cross-section protruding from the bump (4) forming face in the vicinity of the bump (4) and having a guide face (curved surface) directing toward the bump (4) side on the mounting board (3).