Fanless cooling system for electronic components, especially computer CPUs, has a multi-layer heat sink connected to one or more heat transfer tubes that transfer heat away from the processor to the heat sink

摘要

A fanless cooling system for electronic components has a heat transfer tube arrangement (5) with an adapter system for holding the heat emitting end (4) of the tube against a heat sink. The multi-layer heat sink comprises a metal base plate (1) with a heat conduction coefficient higher than aluminum and plates on either side made of aluminum and or copper and or graphite and or an alloy. The plates have cooling fins (3) and or ribs and are connected to each other and the base plate.