| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition of polyimide system which can be developed by alkaline aqueous solution and has high resolution and excellent dimension controllability of pattern, and to provide a method for forming a positive pattern. <P>SOLUTION: The positive photosensitive resin composition comprises a polyimide precursor (A) represented by a general formula (I), a compound (B) represented by a general formula (II), a photosensitive agent (C) which generates acid by means of active light, a photosensitive agent (D) which generates radical by means of active light and solvent (E). The method for forming pattern is composed of a process of forming an insolubilized coating film to an aqueous alkaline solution by using the component (A), a process of exposing with the active light, thereafter, decomposing only the exposed part of the insolubilized coating film by heating, dissolving only the exposure/decomposition part with the aqueous alkaline solution and developing the coating film to the positive pattern and a process of subsequently performing heat treatment for imidization. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
