| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive element excellent in followup ability of a photosensitive resin composition layer to ruggedness on a substrate, a method for manufacturing the same, a resist pattern forming method using the photosensitive element, and a method for manufacturing a printed wiring board. <P>SOLUTION: The photosensitive element comprises a support and a photosensitive resin composition layer formed on the support, wherein the photosensitive resin composition layer comprises (A) 40-80 pts. wt. of a binder polymer, (B) 20-60 pts. wt. of an ethylenically unsaturated polymerizable monomer, (C) 0.001-10 pts. wt. of a photopolymerization initiator and (D) 0.001-5 pts. wt. of an organic solvent, based on 100 pts. wt., in total, of the components (A) and (B). <P>COPYRIGHT: (C)2004,JPO&NCIPI |
