| 摘要 |
PROBLEM TO BE SOLVED: To achieve a high defect detection precision and high throughput. SOLUTION: A microscope system acquires the pattern image of a reference chip by performing AF control to the reference chip in a semiconductor wafer that is a sample 5 being placed on a stage 4, acquires the pattern image of a chip to be inspected by performing AF control to a chip to be inspected in the semiconductor wafer, compares respective pattern images, and inspects the presence or absence of abnormality in the chip to be inspected. In the microscope system, an AF parameter that is optimum for improving focusing speed and focusing precision is set as the AF parameter used for the AF control that is performed to the chip to be inspected, based on sample information acquired by the AF control that is performed to the reference chip, thus performing AF control to the chip to be inspected following the AF parameter. COPYRIGHT: (C)2004,JPO&NCIPI |
