| 摘要 |
A neo-wafer made from integrated circuit die and methods for making a neo-wafer are disclosed. A substrate is provided and includes a dielectric layer with conductive pads for the receiving of one or more integrated circuit die. Die are flip-chip bonded to the conductive pads and all voids under-filled. The neo-wafer is thinned to expose the conductive pads, creating a neo-wafer from which stackable neo-layers with known good die can be singulated.
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