| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize a semiconductor module in which a plurality of semiconductor chips and a plurality of electronic parts are assembled. <P>SOLUTION: The semiconductor module has a module substrate having external electrode terminals and radiation pads on an underside, a first semiconductor chip in which a first-stage transistor for a high-frequency power amplifier is assembled, a second semiconductor chip in which next-stage and final-stage transistors are assembled, and an integrated passive device constituting a matching circuit. At least one chip of the first chip and the second chip and the device are superposed and loaded on the top face of the substrate. The second chip is loaded on the bottom of an indentation formed to the top face of the substrate. A plurality of vias connected to the pads are formed to the bottom of the indentation. The first chip and a discrete part such as a resistor, a capacitor or the like are loaded on the top face of the substrate on the outside of the indentation. The chips and each of parts are covered with a sealing formed on the top face of the substrate. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
