| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method by which the mixing of treatment liquids can be avoided even when a substrate is treated by a plurality of the treatment liquids in one apparatus. SOLUTION: The substrate treatment apparatus has a treatment tank (a first treatment means) 10 in which a plating solution (a treatment liquid) Q is collected on the inside and the substrate W is plated and treated (a dipping treatment), a cover 40 opening and closing the opening section 11 of the tank 10, a spray nozzle (a second treatment means ) 60 installed on the top face of the cover 40, and a substrate holding means 80 adsorbing and holding the rear of the substrate W. The means 80 is lowered under the state in which the cover 40 is removed from the opening section 11 of the tank 10, the substrate W is dipped in the plating solution Q, and the substrate W is plated and treated. The substrate W is washed and treated by the nozzle 60 under the state in which the means 80 is elevated and the opening section 11 of the tank 10 is closed by the cover 40. COPYRIGHT: (C)2004,JPO&NCIPI |
