| 摘要 |
PROBLEM TO BE SOLVED: To provide a module that incorporates components in which the mounting density of components can be enhanced through a simple arrangement regardless of the shape of respective components or the forming position of wire connecting pads. SOLUTION: The module that incorporates components comprises first components 32<SB>j</SB>having first wire connecting pads 35<SB>j</SB>formed on one surface, an interposer substrate 31<SB>j</SB>having second wire connecting pads 34 formed on one surface and openings 49 shaped to correspond with the forming region of the first wire connecting pads 35<SB>j</SB>in the first component 32<SB>j</SB>and mounting the first component 32<SB>j</SB>on the other surface under a state where the first wire connecting pads 35<SB>j</SB>are located in a region on the other side of the opening 49, second components having third wire connecting pads 35<SB>j+1</SB>formed on one surface and mounted on one surface of the interposer substrate 31<SB>j</SB>, and connecting wires 45 for electrically connecting the first wire connecting pads 35<SB>j</SB>and the second wire connecting pads 34. COPYRIGHT: (C)2004,JPO&NCIPI |
