| 摘要 |
PROBLEM TO BE SOLVED: To reduce the occurrence of any crack at a circuit board in a stacked semiconductor device. SOLUTION: The stacked semiconductor device is provided with a first circuit board 12 having a semiconductor element 18, a second circuit board 14 stacked under the first circuit board 12 and having a semiconductor element 26, and a plurality of electrode terminals 24 electrically connecting the first circuit board 12 with the second circuit board 14. The outline of the second circuit board 14 is formed to be larger than that of the first circuit board 12 to house the outline of the second circuit board 14 within the range of that of the first circuit board 12. In the area outside of the second circuit board 14 of the first circuit board 12, the electrode terminals are not arranged. COPYRIGHT: (C)2004,JPO&NCIPI
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