| 发明名称 |
THIN-FILM SEMICONDUCTOR ELEMENT EQUIPPED WITH PROTECTIVE CAP ON FLEXIBLE SUBSTRATE, ELECTRONIC DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thin-film semiconductor element equipped with a protective cap on a flexible substrate, and to provide an electronic device using the same, and a method for manufacturing the same. <P>SOLUTION: The thin-film semiconductor element 70 comprises a semiconductor chip formed on the flexible substrate 51 and the protective cap 63 surrounding the semiconductor chip and the electronic device that utilizes the thin-film semiconductor element 70 comprises the protective cap 63 surrounding the semiconductor chip. In this configuration, due to the protective cap 63 surrounding the semiconductor chip, the durability against the stress produced when the flexible substrate 51 is bent is improved. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
| 申请公布号 |
JP2004214683(A) |
申请公布日期 |
2004.07.29 |
| 申请号 |
JP20040000067 |
申请日期 |
2004.01.05 |
| 申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
KIM DO-YOUNG;PARK WON-JUN;PARK YOUNG-SOO;RI SHUNKI;MIN YO-SEP;KWON JANG-YEON;SEO SUN-AE;CHOI YOUNG-MIN;CHAE SOO-DOO |
| 分类号 |
H01L49/02;G02F1/1333;G02F1/1341;G02F1/1362;H01L21/336;H01L21/60;H01L21/77;H01L21/84;H01L23/31;H01L27/32;H01L29/786;H01L51/52;(IPC1-7):H01L29/786 |
主分类号 |
H01L49/02 |
| 代理机构 |
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