| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a single side lamination wiring board exhibiting excellent reliability efficiently and stably at a low cost with a high yield by eliminating the need for laser boring on the side where a build-up layer is not formed. SOLUTION: A conductive protrusion 88 conducting with a conductor layer 22 is formed on the second major surfaces 14 of two core substrates 12. The second major surfaces 14 of the core substrates 12 are then disposed oppositely and a pair of resin layers 84 sandwiching a conductive metal foil 83 is placed between the second major surfaces 14 and hot pressed in the thickness direction. Consequently, the core substrates 12 are pasted and the forward end of the protrusion 88 penetrates a resin layer 33 to touch the conductive metal foil 83. Subsequently, a build-up layer 18 is formed only on the first major surface 13 side and the pasted core substrates 12 are stripped at the position of the conductive metal foil 83 and divided into two. Finally, the conductive metal foil 83 exposed by dividing the core substrates is patterned to form a connection terminal 37. COPYRIGHT: (C)2004,JPO&NCIPI |
