| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure in which a lead frame extending from electronic components is inserted into a through hole formed in a circuit board, and a surface electrode formed surrounding an output side of this through hole is conductively soldered to the lead frame, thereby preventing a solder from being broken due to an increase in the pressure of a gas such as a flux gas, etc. remaining in the through hole by heating; and to keep the superior conductivity as it is. SOLUTION: A hole diameter regulating member 3 is fitted into through holes 21a, 21b of a circuit board 2, has an axial length which is equal to or longer than a depth of the through hole, and is formed with a fit-in hole 31 for fitting in lead frames 13a, 13b. The lead frames 13a, 13b are fitted in the fit-in hole 31 of the hole diameter regulating member 3 by using the hole diameter regulating member 3, also the hole diameter regulating member 3 is fitted into the through holes 21a, 21b of the circuit board 2, and the circuit board 2 is dipped in a melded solder tub so that the lead frames 13a, 13b are conductively connected to a surface electrode 22. COPYRIGHT: (C)2004,JPO&NCIPI
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