METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MOUNT BOARD AND ELECTRONIC MOUNT BOARD MANUFACTURED BY THIS METHOD

摘要

An electronic component mount board is manufactured by the following method. Firstly, build-up insulation layers (21a-21f) and build-up wiring patterns (22a-22f) are alternately formed on the surface (1a) of a metallic support substrate (1) (Build-up lamination step). Next, a through-hole (11) from the back face (1b) of the support substrate (1) to the front face (1a) is formed to expose the back face (211a) of the innermost build-up insulation layer (21a) (Perforation step). Further, an electronic component (3) is mounted on the back face (211a) of the innermost build-up insulation layer (21a) via the through hole (11) of the support substrate (1) (Mounting step).