发明名称 THERMAL TREATMENT APPARATUS AND METHOD OF MANUFACTURING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To restrain slippage dislocation defects from occurring in a substrate during a thermal treatment so as to manufacture the substrate of high quality. SOLUTION: A substrate support 30 is equipped with a main body 56 composed of struts 38 and supports 60 and movable parts 58. The supports 60 are continuously formed on the lengthwise inside of the main body 56. The support 60 is composed of grooves and equipped with an inner wall 62, an upper wall 64, and a lower wall 66. The movable part 58 is provided in a freely movable manner so as to come into contact with the lower wall 66 of the support 60. The substrate 68 is arranged on the support 60 through the intermediary of the movable parts 58 in a manner in which it can be freely inserted. Therefore, the substrate 68 is supported by the support 60 through the intermediary of the movable parts 58, making its undersurface 70 come into contact with the movable parts 58. The movable part 58 is equipped with a substrate contacting part that is brought into contact with the undersurface 70 of the substrate 68 and a main body contacting part that is brought into contact with the lower wall 66 of the support 60. The main contacting part is so structured as to slide more preferentially than the substrate contacting part. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004214260(A) 申请公布日期 2004.07.29
申请号 JP20020379069 申请日期 2002.12.27
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 NAKAMURA IWAO;NAKAMURA NAOTO;ISHIGURO KENICHI;NAKAJIMA SADAO
分类号 H01L21/683;H01L21/02;H01L21/22;H01L21/31;H01L21/324;H01L21/68;H01L27/12;(IPC1-7):H01L21/68 主分类号 H01L21/683
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