| 摘要 |
PROBLEM TO BE SOLVED: To obtain a heat-resistant adhesive tape which has a widened application temperature range without transferring the adhesive layer to an adherend after the release of the tape by providing the adhesive layer of an adhesive tape with heat resistance and readily controls adhesive power before and after heating by regulating thickness balance between a resin film and the adhesive layer in the case of a large difference in level on the surface of an adherend or thin thickness of an adherend and has functions of adhesivity and supporting properties. SOLUTION: The heat-resistant adhesive tape is obtained by coating one surface of the resin film having 10-100μm thickness with the adhesive layer which has at least 1×10<SP>5</SP>Pa storage elastic modulus in a temperature range of 150°C to 250°C and 3-100μm thickness. COPYRIGHT: (C)2004,JPO&NCIPI
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