| 摘要 |
PROBLEM TO BE SOLVED: To provide an Si laminated body which is hard to break, of which the yield is good, and therefore, which is excellent costwise, and is useful as an Si wafer or the like. SOLUTION: For this Si laminated body, an Si layer is formed by the sputtering method on either one surface or both of the front and rear surfaces of a base sheet. In this case, the base sheet has a thickness of 4 to 1,000μm, and the surface roughness Ra value at an arbitrary temperature at 180°C or higher is 2μm or less. Also, a difference between the Ra value at the arbitrary temperature and the Ra value at 25°C is within 5%. Also, the thickness of the Si layer is 0.0005 to 200μm, and Si layer is made of Si of which the purity is 99.999% or higher. COPYRIGHT: (C)2004,JPO&NCIPI
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