| 摘要 |
A capacitor design, which incorporates a material set that is adaptable to standard substrate or electronic packaging fabrication methods, uses copper as a base and electrode, mesoporous nanocomposite materials or other adhesion promoting materials combined with a high dielectric material specific to the application's capacitance requirements. This capacitor is then used as a basis for forming a capacitor in substrate or package or wafer level package or die or wafer. |
