发明名称 |
Working method of metal material and semiconductor apparatus fabricated by the method |
摘要 |
A method comprising constraining a circumference of a blank of a Cu-Mo alloy and one of surfaces to be worked with the use of a die, and using a working punch or a counter punch to apply working pressures to the other of the surfaces to be worked, thereby obtaining a cup-shaped body.
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申请公布号 |
US2004147083(A1) |
申请公布日期 |
2004.07.29 |
申请号 |
US20040753406 |
申请日期 |
2004.01.09 |
申请人 |
HITACHI, LTD. |
发明人 |
KOBAYASHI MASAYUKI;HARADA KOUJI;TOKUDA HIROATSU;OJIMA KAZUO |
分类号 |
H01L21/48;H01L25/07;(IPC1-7):H01L21/20;H01L21/44 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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