发明名称 Working method of metal material and semiconductor apparatus fabricated by the method
摘要 A method comprising constraining a circumference of a blank of a Cu-Mo alloy and one of surfaces to be worked with the use of a die, and using a working punch or a counter punch to apply working pressures to the other of the surfaces to be worked, thereby obtaining a cup-shaped body.
申请公布号 US2004147083(A1) 申请公布日期 2004.07.29
申请号 US20040753406 申请日期 2004.01.09
申请人 HITACHI, LTD. 发明人 KOBAYASHI MASAYUKI;HARADA KOUJI;TOKUDA HIROATSU;OJIMA KAZUO
分类号 H01L21/48;H01L25/07;(IPC1-7):H01L21/20;H01L21/44 主分类号 H01L21/48
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