| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily discover an abnormal shape resulting from dicing in a manufacturing process for a chip type semiconductor light-emitting device. <P>SOLUTION: Marks 9 are put previously on sections on a substrate 1, through which a dicing edge 21 is passed when each semiconductor light-emitting device is parted by the dicing from an intermediate M, in which a plurality of the semiconductor light-emitting devices are continued and unified, and the defective or nondefective of the semiconductor light-emitting devices is decided by whether or not the marks 9 are left on the substrates 1 of the parted semiconductor light-emitting devices. It is preferable that lines having thicknesses thinner than the thickness D of the dicing edge 21 are used as the marks for further improving the accuracy of a decision in this case. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
