发明名称 |
HEAT-TREATMENT APPARATUS USED IN MAGNETIC FIELD |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat-treatment apparatus used in a magnetic field which yields a high-quality semiconductor element and can be downsized. SOLUTION: The heat-treatment apparatus used in a magnetic field has a tubular heat-treatment furnace (3) which is laid down so that it has its central axis (O) in the horizontal direction. Outside this heat-treatment furnace (3), a tubular superconducting solenoid magnet (1) having the same central axis (O) as the heat-treatment furnace (3) is installed to form a uniform magnetic field in parallel with the central axis (O) within the heat-treatment furnace (3). The apparatus also has heating means (6) of the heat-treatment furnace (3) and wafer-conveying units (5) inside the heat-treatment furnace (3) to enable continuous heat treatment of a wafer. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004211167(A) |
申请公布日期 |
2004.07.29 |
申请号 |
JP20030000338 |
申请日期 |
2003.01.06 |
申请人 |
JAPAN SUPERCONDUCTOR TECHNOLOGY INC |
发明人 |
HAYASHI SEIJI;HIROSE RYOICHI;FUKUMIZU SHINICHI |
分类号 |
C21D1/04;F27B9/04;F27B9/06;F27B9/08;F27B9/20;F27B9/26;F27D3/12;F27D11/02;F27D19/00;H01L21/02;H01L21/8246;H01L27/105;H01L43/08;H01L43/12;(IPC1-7):C21D1/04 |
主分类号 |
C21D1/04 |
代理机构 |
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代理人 |
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地址 |
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