发明名称 HEAT-TREATMENT APPARATUS USED IN MAGNETIC FIELD
摘要 PROBLEM TO BE SOLVED: To provide a heat-treatment apparatus used in a magnetic field which yields a high-quality semiconductor element and can be downsized. SOLUTION: The heat-treatment apparatus used in a magnetic field has a tubular heat-treatment furnace (3) which is laid down so that it has its central axis (O) in the horizontal direction. Outside this heat-treatment furnace (3), a tubular superconducting solenoid magnet (1) having the same central axis (O) as the heat-treatment furnace (3) is installed to form a uniform magnetic field in parallel with the central axis (O) within the heat-treatment furnace (3). The apparatus also has heating means (6) of the heat-treatment furnace (3) and wafer-conveying units (5) inside the heat-treatment furnace (3) to enable continuous heat treatment of a wafer. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004211167(A) 申请公布日期 2004.07.29
申请号 JP20030000338 申请日期 2003.01.06
申请人 JAPAN SUPERCONDUCTOR TECHNOLOGY INC 发明人 HAYASHI SEIJI;HIROSE RYOICHI;FUKUMIZU SHINICHI
分类号 C21D1/04;F27B9/04;F27B9/06;F27B9/08;F27B9/20;F27B9/26;F27D3/12;F27D11/02;F27D19/00;H01L21/02;H01L21/8246;H01L27/105;H01L43/08;H01L43/12;(IPC1-7):C21D1/04 主分类号 C21D1/04
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