| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure for an electronic component and its manufacturing method capable of increasing the number of wirings between electrodes and reducing the number of layers of a circuit substrate, by decreasing the size of a terminal electrode on a circuit substrate upon connecting an area array mounting component to the circuit substrate. SOLUTION: In the mounting structure for an electronic component composed of the area array mounting component 1 joined to the circuit substrate 5 with a conductive adhesive agent 7, the size of a second terminal electrode 4 formed at the side of the circuit substrate 5 is decreased compared with that of a first terminal electrode 2 formed on the area array mounting component 1. COPYRIGHT: (C)2004,JPO&NCIPI
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