发明名称 |
DRIVE-CHIP-INTEGRALLY-FORMED LASER DIODE MODULE AND OPTICAL PICKUP DEVICE EMPLOYING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a drive-chip-integrally-formed laser diode module that has integrally formed a drive chip required for driving the laser diode and an optical pickup device that has employed the same. SOLUTION: The drive-chip-integrally-formed laser diode module that produces and irradiates laser beams comprises: a laser diode module main body having a plurality of first leads protrusively arranged at the outside thereof to receive power supply; a drive chip having connection holes between which the first leads are sandwiched, internal connectors provided within the connection holes and electrically connected to the first leads, and a plurality of second leads protrusively arranged at the outside thereof; and a main substrate having a plurality of lands electrically connected to the second leads and a through-hole through which the laser diode module main body is penetrated, and is characterized in that the drive chip and the main substrate are integrally formed with the laser diode module main body. COPYRIGHT: (C)2004,JPO&NCIPI
|
申请公布号 |
JP2004214678(A) |
申请公布日期 |
2004.07.29 |
申请号 |
JP20030434417 |
申请日期 |
2003.12.26 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
PARK KI-JAE;RI SHUHYUN;SEONG PYONG-YONG |
分类号 |
H01S5/022;G11B7/125;(IPC1-7):H01S5/022 |
主分类号 |
H01S5/022 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|