| 摘要 |
PROBLEM TO BE SOLVED: To surely prevent the adhesion of an icicle-shaped substance while an existing flow soldering device is used as it is. SOLUTION: The terminal section 3 of a bus bar 2 is insered into the through-hole 6 of a printed board 1 as a board body, the printed board 1 is carried to the flow soldering device A and a section between the terminal section 3 and the through-hole 6 is connected with solder. A chamfering section 5 is formed to the terminal section 3 projected from the solder surface 1a of the printed board 1 while being positioned on the rear side of the direction of carrying R of the printed board 1. COPYRIGHT: (C)2004,JPO&NCIPI
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