发明名称 |
Stacked semiconductor packages and method for the fabrication thereof |
摘要 |
A method for fabricating a stacked semiconductor package includes providing a substrate and mounting a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semiconductor device is then mounted on the interposer.
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申请公布号 |
US2004145039(A1) |
申请公布日期 |
2004.07.29 |
申请号 |
US20030676736 |
申请日期 |
2003.09.30 |
申请人 |
ST ASSEMBLY TEST SERVICES LTD. |
发明人 |
SHIM IL KWON;RAMAKRISHNA KAMBHAMPATI;CHOW SENG GUAN;HAN BYUNG JOON |
分类号 |
H01L25/065;H01L25/10;H01L25/16;(IPC1-7):H01L23/02 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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