JOINTING METHOD FOR ELECTRONIC COMPONENTS, AND JOINTING DEVICE USED FOR THE METHOD

摘要

A jointing method, comprising the steps of pressing, by a load, a first jointed object (1) having first joint parts (10) formed of conductors and a second jointed object (2) having second jointing parts (20) formed of conductors so that the first joint parts (10) can be jointed to the second joint parts (20) by applying ultrasonic vibration to the first jointed object (1) in a first direction orthogonal to the direction (arrow f) of the load and to the second jointed object (2) in a second direction parallel with the direction (arrow f) of the load.